RoHS-DEVICE
Power Package Serials
TO-3P October 20, 2010
TO-247 October 20, 2010
TO-220 November 2, 2011
ITO-220 November 2, 2011
TO-252 October 20, 2010
TO-262/I2PAK October 11, 2010
TO-263/D2PAK October 11, 2010
TO-126 May 10, 2011
TO-92 October 13, 2011
DO-41 October 12, 2011
DO-41S October 12, 2011
DO-15 October 12, 2011
DO-27/DO-201AD October 12, 2011
DO-34
 October 12, 2011
DO-35 October 12, 2011
SMA October 12, 2011
SMB
 October 12, 2011
SMC October 12, 2011
Surface Mount Serials
POWERLITE October 28, 2010
SMA/DO-214AC October 28, 2010
SMB/DO-214AA October 28, 2010
SMC/DO-214AB October 28, 2010
SOT-23 October 28, 2010
SOT-23-6L October 28, 2010
SOT-89 October 28, 2010
SOT-323 October 28, 2010
SOT-353 October 28, 2010
SOT-363 October 28, 2010
SOT-523 October 28, 2010
SOT-563 October 28, 2010
SOD-80 October 28, 2010
SOD-123 October 28, 2010
SOD-323 October 28, 2010
SOD-523 October 28, 2010
SOD-723 October 28, 2010
SOD-923 October 28, 2010
SOP-8 October 28, 2010
MSOP10 October 28, 2010
DFN October 28, 2010
     
PFOS/PFOA/PAHs/PBBs/PBDEs-DEVICE
TO-3P November 16, 2009
T0-247 November 16, 2009
TO-220 November 16, 2009
ITO-220 November 16, 2009
     
REACH-DEVICE
TO-3P May 19, 2009
TO-247 May 19, 2009
TO-220 May 19, 2009
TO-126 May 19, 2009
TO-92 May 19, 2009
DO-41 May 19, 2009
DO-15 May 19, 2009
DO-27 May 19, 2009
     
HALOGEN-FREE
TO-220 July 29, 2011
ITO--220 July 29, 2011
TO-126 April 19, 2010
DO-41 October 12, 2011
DO-15 October 12, 2011
TO-92 November 30, 2008
SMD October 12, 2011
     
RoHS-MATERIAL
Axial Lead Package
Copper Lead-SHAEC1100402402 January 13, 2011
Epoxy molding compound-CE2010B2286 November 18, 2010
Epoxy molding compound-CR2010B0109A November 29, 2010
Pure Tin Plating Additive SYT843-SHAEC1111210005 July 19, 2011
Solder-TJTC1022069CHEM December 13, 2010
UV BON 400 Ink-SHAEC1106392103 May 10, 2011
Axial Lead Package(E & L series)
Copper Wire-SHAEC1101521503 February 17, 2011
Epoxy Molding Compound-CE2010B2286 November 18, 2010
Plating-GZ111007326CHEM January 24, 2011
Solder-SHAEC1100769701 January 21, 2011
UV Silver Ink-GZ1011131509CHEM November 25, 2010
Surface Mount Device
Epoxy Molding compound-CE2010B2286 November 18, 2010
Lead Frame-SHAEC1106434301 May 10, 2011
Plating-RLSHD000672420003 July 08, 2011
Solder-RLSHD000546990001C March 04, 2011
TO-92
Au wire-SHAEC1108771103 July 14, 2011
DAD-87-SHAEC110715501 July 12, 2011
DAD-87-SHAEC1110715503 July 12, 2011
Epoxy molding compound-GZ1011127682CHEM November 13, 2010
Epoxy molding compound-GZ1105061075CHEM May 20, 2011
Frame with copper alloy-SHAEC1102588607 March 15, 2011
Gold bonding wire-SHAEC1100514403 January 18, 2011
Gold bonding wire-SHAEC1101350821 A02 April 08, 2011
Gold bonding wire-SHAEC1101718811 A02 April 08, 2011
Lead frame-SHAEC1100550417 January 20, 2011
Tin-CANEC1103340401 September 01, 2011
Wafer-CE_2011_A1014A October 26, 2011
TO-220 & ITO-220(Halogen-Free)
Al wire-KA2010B1710 December 03,2011
Copper base metal-CE201116255 February 08, 2011
Epoxy molding compound-KA201130831 March 18, 2011
Lead frame-KA201131598 March 30, 2011
Plating-KA201151735 June 07, 2009
Solder Wire-LPCI1404411 June 17, 2009
TO-247 & TO-3P
Al Wire-LPCI1691711 July 25, 2011
Epoxy Molding Compound-KA2010A1435 November 02, 2010
Lead Frame-SHAEC1100550417 January 20, 2011
Solder-GZ1103023148CHEM May 09, 2011
Tin-CANEC1103340401 September 01, 2011
     
MSDS
MBR20100CT April 2009
MBR10100CT April 2009
MBR10L100FCT/H April 2009
SB540 April 2009
SB2100 April 2009
SB3100 April 2009
TL431 April 2009